Phys.org

Researchers from the National University of Singapore (NUS) have developed a method to turn waste from the tough, lightweight composites used in aircraft and other high-performance structures into aerogels that could be used for thermal insulation, sound absorption and oil spill cleanup.

In the coming years, increasingly larger and more powerful quantum systems are expected to tackle problems that are difficult or impossible to solve using conventional computers. However, the more powerful quantum simulations become, the more difficult it is to independently verify their results. Where classical simulation is still feasible, results can be cross-checked directly; beyond that regime, other methods are needed.

Decommissioning pipelines used by the oil and gas industry could result in substantial quantities of microplastics being released into the UK

For many parents, keeping their children safe online is a top priority. But now there

From searching disaster zones and responding to chemical spills to monitoring fragile ecosystems, future robot swarms may have to act in places where direct human control is difficult or dangerous. To operate autonomously, the robots must be able to decide together which problem to address and where to go next. But collective decision-making creates its own vulnerability: Robots improve their decisions by sharing information, yet faulty machines, inaccurate observations or manipulated messages c

Researchers in the Riccio College of Engineering at the University of Massachusetts Amherst have demonstrated that redesigning both hardware and algorithms can make AI applications on edge devices more efficient. As proof of concept, their system achieved 95.24% accuracy in language identification while reducing computing resources by 90%

Weaving is an ancient craft that is still practiced as a hobby by many people around the world. In recent years, it has found new life as more people have returned to hands-on making as a way to slow down, reconnect with materials and step away from screens.

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary technologies helps overcome the key challenges in building high-performance artificial intelligence (AI) hardware.