SENSEX
NIFTY
GOLD
USD/INR

Weather

image 30    C

Hardware News

Phys.org

Hardware / Phys.org

details

A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary technologies helps overcome the key challenges in building high-performance artificial intelligence (AI) hardware.

12 Aug 2026 9:50 pm